Computing Fabric for high performance Applications
Publications
- Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors
S.S. Kumar; A. Zjajo; T.G.R.M. van Leuken;
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
Volume 25, Issue 4, pp. 1549-1562, 2017. ISSN 1063-8210. DOI: 10.1109/TVLSI.2016.2642587
document - Immediate Neighborhood Temperature Adaptive Routing for Dynamically Throttled 3-D Networks-on-Chip
S. S. Kumar; A. Zjajo; R. van Leuken;
IEEE Transactions on Circuits and Systems II: Express Briefs,
Volume 64, Issue 7, pp. 782-786, July 2017. ISSN 1549-7747. DOI: 10.1109/TCSII.2015.2503613
document - A real-time hybrid neuron network for highly parallel cognitive systems
G.J. Christiaanse; A. Zjajo; C. Galuzzi; R. van Leuken;
In Engineering in Medicine and Biology Society (EMBC), 2016 IEEE 38th Annual International Conference of the,
IEEE, pp. 792--795, 2016. DOI: 10.1109/EMBC.2016.7590820
document - Multi-chip dataflow architecture for massive scale biophysically accurate neuron simulation
J. Hofmann; A. Zjajo; C. Galuzzi; R. van Leuken;
In IEEE International Conference of the IEEE Engineering in Medicine and Biology Society,
Orlando, Florida, pp. 5829-5832, 2016.
document - Physical characterization of steady-state temperature profiles in three-dimensional integrated circuits
S. Kumar; A. Zjajo; R. van Leuken;
In IEEE International Symposium on Circuits and Systems,
Lisbon, Portugal, pp. pp. 1969-1972, 2015.
document - Ctherm: A integrated framework for thermal-functional co-simulation of systems-on-chip
S. Kumar; A. Zjajo; R. van Leuken;
In IEEE International Conference on Parallel, Distributed and Network-based Processing,
Turku, Finland, pp. pp. 674-681, 2015.
document - Thermal-Aware Design and Runtime Management of 3D Stacked Multiprocessors
S.S. Kumar;
PhD thesis, TU Delft, Fac. EEMCS, September 2015. ISBN 978-94-6186-513-7.
document - A System Level Methodology for Interconnect Aware and Temperature Constrained Power Management of 3D MP-SoCs
S. Kumar; A. Aggarwal; R. Jagtap; A. Zjajo; R. van Leuken;
IEEE Transactions on Very Large Scale Integration (VLSI) Systems,
2013. in press.
document - Cit: A GCC Plugin for the Analysis and Characterization of Data Dependencies in Parallel Programs
S.S. Kumar; A. Chahar; R. van Leuken;
In Int. Conf. Design of Circuits and Integrated Systems,
San Sebastian (Spain), 2013.
document - Low Overhead Message Passing for High Performance Many-Core Processors
S.S. Kumar; M.E. Tjin-A-Djie; R. van Leuken;
In Int. Symp. Computing and Networking,
Matsuyama (Japan), 2013.
document - Interconnect and Thermal Aware 3D Design Space Exploration
S. Kumar; A. Aggarwal; R. Jagtap; A. Zjajo; R. van Leuken;
In ICT.OPEN,
Eindhoven, The Netherlands, 2013.
document - A Precise and High Speed Charge-Pump PLL Model Based on SystemC/SystemC-AMS
Kezheng Ma; T.G.R.M. van Leuken; M. Vidojkovic; J. Romme; S. Rampu; H. Pflug; Li Huang; Guido Dolmans;
Intl. Journal of Electronics and Telecommunications,
Volume 58, Issue 3, pp. 225-231, September 2012. ISSN 0867-6747. DOI: 10.2478/v10177-012-0031-5 - A 11 uW 0C-160C Temperature Sensor in 90 nm CMOS for Adaptive Thermal Monitoring of VLSI Circuits
A. Zjajo; N.P. van der Meijs; T.G.R.M. van Leuken;
In Proceedings of ISCAS 2012,
Seoul, Korea, May 2012.
document - Thermal Analysis of 3D Integrated Circuits Based on Discontinous Galerkin Finite Element Method
A. Zjajo; N.P. van der Meijs; T.G.R.M. van Leuken;
In Proceedings of ISQED 2012,
Santa Clara, CA, USA, March 2012.
document - Temperature Constrained Power Management Scheme for 3D MPSoC
A. Aggarwal; S. Kumar; A. Zjajo; T.G.R.M. van Leuken;
In Proceedings of SPI 2012,
Sorrento, Italy, May 2012.
document - A Methodology for Early Exploration of TSV Placement Topologies in 3D Stacked ICs
R. Jagtap; S.S. Kumar; T.G.R.M. van Leuken;
In 15th Euromicro Conference on Digital System Design,
Cesme, Turkey, September 2012. - System Fault-tolerance Analysis of Small Satellite On-board Computers
D. Burlyaev; T.G.R.M. van Leuken;
In XXVII Conference on Design of Circuits and Integrated Systems (DCIS 2012),
Avignon, France, November 2012.