MSc thesis project proposal
Vacuum-assisted Through-Silicon Vias (TSV) Fabrication using Cu nanoparticles sintering
The need for more functionalization, miniaturization and lower energy consumption drives the ongoing semiconductor industry. Vertical interconnects for 3D integration takes advantage of the shorter total length of the interconnect, lower resistance, reduction in the signal delay and avoidance of parasitic inductances. Through-silicon vias (TSV) has been enabling high-density, 3D interconnections among integrated circuits (IC) and microelectromechanical systems (MEMS) packaging for the last decade. Conventional TSV fabrication requires multi-step processes and sophisticated equipment.
Nanoparticles have many unique properties due to the size effect. Cu nanoparticle can be sintered at low temperature to form continuous structure, which has similar properties as its bulk state, for instance, melting point, thermal and electrical conductivities. Thus, low-temperature sintering of Cu nanoparticles paves a way to a seedless TSV fabrication method with a simple vacuum-assisted filling process.
This project aims to develop a high aspect-ratio TSV fabrication method using low-temperature sintering of Cu nanoparticles. Building onto the group’s knowledge, the project will help develop a deeper understanding of sintering behaviour of Cu nanoparticles and processing aspects of vacuum-assisted TSV filling technology.
AssignmentThis hands-on project will include:
- An extensive review of the related state-of-the-art;
- The development of vacuum-assisted filling technology;
- The development of TSV fabrication by using Cu nanoparticles;
- Measurement of the diameter and aspect ratio of the vias;
- Characterization of the electrical conductivity;
- The development of TSV fabrication on different substrates;
- Comprehensive reporting of the full experimental work.
RequirementsYou are an ambitious master student looking for hands-on experience and a multidisciplinary thesis project on microfabrication and nanomaterials. You have a microelectronics, chemistry, nanotechnology or material science background and like experimental lab work. Good communication skill in English and a pro-active attitude are expected.
MSc Dong Hu
Electronic Components, Technology and Materials Group
Department of Microelectronics
Last modified: 2020-09-14